Design and Development of Dielectric Insulation and Encapsulation Systems - Our "Material Selection Model" validates material selection and design configuration, facilitates manufacturing plan development and assesses life cycle performance; while reducing cost, schedule and reliance on full scale modeling and prototype development.

Generic Epoxy Resin System Formulations - Our "Formulation Development Program" develops generic polymer resin systems; enabling your engineering team to select a resin system for cured property values and process parameters optimized to meet your design configuration performance specifications and assembly methodology.

Recovery of Electrical and Electronic Components - "Differential De-Encapsulation" enables the selective, non-destructive removal of advanced thermoset resin based systems to permit the interlaminar penetration of a cured system; to both examine critical areas and recover metallic and non-metallic components for repair or remanufacture. 

Remote Repair of Conductor Cooling Line Leaks in Dielectric Insulation Systems - "Vacuum Pressure Sealing" delivers a two component, room temperature cure epoxy sealant, capable of withstanding 600 psi. hydrostat test, into coil winding conductor lengths in excess of 1500 linear feet.
 

Training Seminars - We offer both on-site training at the task, project or program level to assist your engineering team in developing quality manufacturing plans.

To learn more about our Technical Support Services and how we can assist you; please E-Mail us at:

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